DocumentCode
2354504
Title
Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)
fYear
2003
fDate
27-29 Oct. 2003
Abstract
The following topics are dealt with: RF/microwave techniques; system design and technology; power distribution design and noise; electromagnetic issues; transmission lines; measurements; on-chip issues and interconnection macromodeling.
Keywords
electronics packaging; RF techniques; electrical performance; electromagnetic issues; electronic packaging; interconnection macromodeling; measurements; microwave techniques; noise; on-chip issues; power distribution design; system design; transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2003
Conference_Location
Princeton, NJ, USA
Print_ISBN
0-7803-8128-9
Type
conf
DOI
10.1109/EPEP.2003.1249986
Filename
1249986
Link To Document