Effect of polymer liners in CNT based through silicon vias

Polymer liners have provided potentially attractive solutions over conventional silicon dioxide (SiO₂) in singlewalled carbon nanotube (SWCNT) bundle based through silicon vias (TSVs). Using SiO₂ and different polymer liners (such as BCB, PPC and polyimide), this paper analyzes the delay with and without crosstalk for different TSV heights and radius. It is observed that the crosstalk coupling is prominently influenced by the dielectric constant of the materials lying between the TSV and the Si substrate. For a SWCNT bundled TSV with higher aspect ratio, the crosstalk delay is reduced by 43.8%, 36.5% and 19.3% for BCB, PPC and polyimide, respectively, in comparison to conventional SiO₂ liner.