Rehabilitation technology for physically handicapped persons, the Viennese High Tech Program

Author

Thoma, Herwig ; Bijak, Manfred ; Girsch, Werner ; Holle, Jürgen ; Howorka, Kinga ; Lanmüller, Hermann ; Prulamp, Günter

Author_Institution

Dept. of Biomed. Eng. & Phys., Wien Univ., Austria

fYear

1995

fDate

15-18 Feb 1995

Firstpage

21610

Lastpage

21976

Abstract

The application of “high-tech” instruments for physically handicapped people depends on: (1) the knowledge of the market, (2) the education of the rehabilitation team, (3) an individual adjustment of the devices to the special needs of the handicapped, (4) the maintenance and service of the devices, (5) the resources for financing, and (6) integration in a rehabilitation strategy. The activities of our group concern educational approaches for patient rehabilitation, and research, development and clinical application of new systems in functional electrostimulation (FES). A special rehabilitation strategy called “functional rehabilitation” was developed to support the application procedure

Keywords

biomedical education; biomedical equipment; finance; handicapped aids; maintenance engineering; pacemakers; Viennese High Tech Program; clinical application; device maintenance; device servicing; environment control; financial resources; functional electrostimulation; functional rehabilitation; high-technology instruments; individual device adjustment; lower extremities; market knowledge; mobility; multichannel implants; paraplegia; patient rehabilitation technology; phrenic pacemaker; physically handicapped people; rehabilitation strategy integration; rehabilitation team education; research and development; special needs; Biomedical engineering; Educational technology; Electrodes; Fatigue; Implants; Instruments; Legged locomotion; Pacemakers; Seminars; Spinal cord injury;

fLanguage

English

Publisher

ieee

Conference_Titel

Engineering in Medicine and Biology Society, 1995 and 14th Conference of the Biomedical Engineering Society of India. An International Meeting, Proceedings of the First Regional Conference., IEEE

Conference_Location

New Delhi

Print_ISBN

0-7803-2711-X

Type

conf

DOI

10.1109/RCEMBS.1995.532976

Filename

532976