Partitioned conduction modes in surface integral equation-based impedance extraction

Author

Hu, Xin ; Daniel, Luca ; White, J.

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA

fYear

2003

fDate

27-29 Oct. 2003

Firstpage

355

Lastpage

358

Abstract

In this paper, conduction mode basis functions, previously developed to improve the efficiency of volume integral equation-based electromagnetic analysis of interconnect, are adapted for use in a surface integral equation formulation. A partitioning scheme is introduced to eliminate low-frequency ill-conditioning. Results for a wire, ring and transmission line are used to show that combining partitioned conduction modes with a Galerkin discretization scheme improves the surface integral solver´s wideband accuracy and efficiency.

Keywords

Galerkin method; Green´s function methods; circuit analysis computing; computational electromagnetics; electric field integral equations; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; iterative methods; Galerkin discretization scheme; Green´s functions; IC package; conduction mode basis functions; electromagnetic analysis; impedance extraction; iterative method; low-frequency ill-conditioning; partitioned conduction modes; ring; straight package wire; surface integral equation formulation; transmission line; wideband accuracy; Conductors; Frequency; Integral equations; Integrated circuit interconnections; Packaging; Proximity effect; Skin; Surface impedance; Transmission lines; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2003

Conference_Location

Princeton, NJ, USA

Print_ISBN

0-7803-8128-9

Type

conf

DOI

10.1109/EPEP.2003.1250067

Filename

1250067