Title :
Integral equation based time domain coupled EM-circuit simulation for packaged conductors and dielectrics
Author :
Yang, Chuanyi ; Ouyang, Gong ; Jandhyala, Vikram
Author_Institution :
Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
Abstract :
A full-wave time domain integral equation formulation for the simulation of finite conductors and dielectrics, linked to linear and non-linear lumped elements, is presented. The method permits coupled rigorous simulation including accounting for EMI and non-linearities in the presence of material effects. In addition, a new quadrature scheme is incorporated for exactly computing temporal delays between every section of finite basis functions defined over triangular patches. This enables finer time step resolution for non-uniform meshes than is permissible with standard Gaussian quadrature and singularity extraction.
Keywords :
circuit simulation; computational electromagnetics; coupled circuits; electromagnetic interference; integral equations; lumped parameter networks; mesh generation; nonlinear network analysis; EMI; finite basis functions; finite conductors; finite dielectrics; full-wave time domain analysis; integral equation based EM-circuit simulation; linear lumped elements; nonlinear lumped elements; nonuniform meshes; packaged conductors; packaged dielectrics; temporal delay computation; time domain coupled EM-circuit simulation; time step resolution; triangular patches; Circuit simulation; Computational modeling; Conducting materials; Conductors; Coupling circuits; Dielectrics; Integral equations; Integrated circuit interconnections; Packaging; Scattering;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2003
Conference_Location :
Princeton, NJ, USA
Print_ISBN :
0-7803-8128-9
DOI :
10.1109/EPEP.2003.1250071
