DocumentCode
2357604
Title
The thermal management of a seven-die multichip module
Author
Feng, Andy ; Hsieh, Alex
Author_Institution
Semicond. Group, Orient Semicond. Electron. Ltd., Kaohsiung, Taiwan
fYear
2002
fDate
12-14 March 2002
Firstpage
57
Lastpage
63
Abstract
The thermal management of a multichip module (MCM) is not an easy task due to the much harsher thermal requirements especially where a 7-die MCM is concerned. The thermal management for this module has been investigated. This paper describes how to manage the thermal requirements of MCM for various package types such as flip chip and stacked-die solutions.
Keywords
forced convection; multichip modules; thermal management (packaging); thermal resistance; flip chip; package types; seven-die multichip module; stacked-die solutions; thermal management; thermal requirements; Computational fluid dynamics; Computational modeling; Electromagnetic compatibility; Electronic packaging thermal management; Flip chip; Heat sinks; Multichip modules; Thermal management; Thermal management of electronics; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium
Conference_Location
San Jose, CA, USA
ISSN
1065-2221
Print_ISBN
0-7803-7327-8
Type
conf
DOI
10.1109/STHERM.2002.991346
Filename
991346
Link To Document