DocumentCode
235822
Title
XPS and TEM studies of oxidation states on Sn solder ball
Author
Shen Yiqiang ; Chen Yixin ; Lee Hwang Sheng ; Chow Shue Yin ; Xing Zhen Xiang ; Hua Younan ; Li Xiaomin
Author_Institution
WinTech Nano-Technol. Services Pte. Ltd., Singapore, Singapore
fYear
2014
fDate
June 30 2014-July 4 2014
Firstpage
123
Lastpage
126
Abstract
A Sn oxide layer on the surface of Sn solder balls plays an important role in the semiconductor packaging industry. This paper shows a comprehensive analysis of the Sn oxide layer by XPS depth profiles. The distribution of Sn with different oxidation states can be derived from curves fitting Sn3d5/2 peaks. Moreover, the oxide layer thicknesses obtained from XPS demonstrate a linear correlation with the values from TEM measurements.
Keywords
X-ray photoelectron spectra; curve fitting; oxidation; semiconductor device packaging; soldering; tin; transmission electron microscopy; Sn; Sn3d5/2 peak; TEM; XPS depth profile; curve fitting; linear correlation; oxidation state; oxide layer thickness; semiconductor packaging industry; solder ball; Chemicals; Deconvolution; Oxidation; Rough surfaces; Thickness measurement; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location
Marina Bay Sands
ISSN
1946-1542
Print_ISBN
978-1-4799-3931-2
Type
conf
DOI
10.1109/IPFA.2014.6898151
Filename
6898151
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