DocumentCode
2358334
Title
Statistical methodology for yield enhancement via baseline reduction
Author
Fridgeirsdottir, Kristin ; Akella, Ram ; Li, Mien ; McNally, Peter ; Mittal, Sanjiv
Author_Institution
Dept. of Eng., Stanford Univ., CA, USA
fYear
1998
fDate
23-25 Sep 1998
Firstpage
77
Lastpage
81
Abstract
In this paper, we introduce a DOE-regression based methodology to identify which tools, in a segment of a fab line between two inspection stations, are defect generating. The approach estimates how much the yield could increase by repairing each of the tools. Furthermore, the tools can be ordered for repair according to this potential yield increase. The estimate of the yield increase includes an evaluation of the power of the statistical test performed to identify the defect generating tools, as well as the kill ratio. By identifying the problem-prone tools and repairing them in the order given by the estimated yield increase, the process baseline can be lowered in an effective manner and the yield increased
Keywords
design of experiments; inspection; integrated circuit testing; integrated circuit yield; maintenance engineering; DOE-regression based methodology; baseline reduction; defect generating tools; estimated yield increase; fab line segment; inspection stations; kill ratio; problem-prone tool identification; process baseline; statistical methodology; statistical test power; tool repair; tool repair ordering; yield enhancement; Costs; Inspection; Operations research; Performance evaluation; Power generation; Sampling methods; Statistical analysis; Systems engineering and theory; Testing; Yield estimation;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
0-7803-4380-8
Type
conf
DOI
10.1109/ASMC.1998.731402
Filename
731402
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