• DocumentCode
    2358683
  • Title

    1991 Proceedings, Seventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.91CH2972-8)

  • fYear
    1991
  • fDate
    12-14 Feb. 1991
  • Abstract
    The following topics are dealt with: analytical modeling; measurement techniques; thermal characterization; and analytical and computational modeling
  • Keywords
    integrated circuit technology; packaging; printed circuits; semiconductor technology; thermal analysis; thermal variables measurement; analytical modeling; analytical models; computational modeling; measurement techniques; printed circuits; semiconductor processing; thermal characterization; thermal management; thermal measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 1991. SEMI-THERM VII. Proceedings., Seventh Annual IEEE
  • Conference_Location
    Phoenix, AZ, USA
  • Print_ISBN
    0-87942-664-0
  • Type

    conf

  • DOI
    10.1109/STHERM.1991.152931
  • Filename
    152931