• DocumentCode
    235883
  • Title

    Characterization of wet chemical etching for effective backside sample preparation on devices with exposed pads

  • Author

    Sabate, Andrew C. ; Galarce, Rowin V.

  • Author_Institution
    Product Anal. Lab., ON Semicond. Malaysia Sbn Bhd, Seremban, Malaysia
  • fYear
    2014
  • fDate
    June 30 2014-July 4 2014
  • Firstpage
    94
  • Lastpage
    97
  • Abstract
    With the growing complexity of Integrated Circuit (IC) design having multiple metallization layers and copper wire bonded devices, most of the time backside fault isolation is a better approach. This paper evaluated wet chemical backside sample preparation as an alternative method for the traditional milling/polishing backside sample preparation.
  • Keywords
    etching; fault diagnosis; integrated circuit metallisation; integrated circuit testing; lead bonding; backside fault isolation; backside polishing alternative; copper wire bonded device; exposed pad; integrated circuit design; metallization layer; traditional milling alternative; wet chemical backside sample preparation; wet chemical etching; Chemicals; Circuit faults; Etching; Failure analysis; Integrated circuits; Milling; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
  • Conference_Location
    Marina Bay Sands
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-3931-2
  • Type

    conf

  • DOI
    10.1109/IPFA.2014.6898186
  • Filename
    6898186
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=235883