DocumentCode
235902
Title
ICP-RIE Platinum (Pt) sputter etching
Author
Mendaros, R.G. ; Marcelo, M.T.
Author_Institution
Worldwide Product Anal., Analog Devices Gen. Trias (ADGT), Cavite, Philippines
fYear
2014
fDate
June 30 2014-July 4 2014
Firstpage
114
Lastpage
117
Abstract
One of the coating materials that is used to reduced electron charging effect during Scanning Electron Microscope (SEM) imaging is Platinum (Pt). Removing Pt coating for parts requiring further electrical testing or deprocessing has been a challenge in failure analysis. This paper discusses the established methodology in removing Pt coating using the ICP-RIE sputter etching technique.
Keywords
coatings; failure analysis; platinum; scanning electron microscopy; sputter etching; ICP-RIE platinum sputter etching technique; Pt; SEM imaging; coating material; coating removal; electrical testing; electron charging effect; failure analysis; inductive coupled plasma; scanning electron microscope imaging; Coatings; Etching; Materials; Scanning electron microscopy; Sputtering; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location
Marina Bay Sands
ISSN
1946-1542
Print_ISBN
978-1-4799-3931-2
Type
conf
DOI
10.1109/IPFA.2014.6898195
Filename
6898195
Link To Document