DocumentCode
2359149
Title
Electrokinetics and electromechanics in controlled release from ionizable gels: theory & experiments
Author
Sachs, Jeffrey R. ; Siegel, Ronald A.
Author_Institution
Daniel H. Wagner & Associates, Sunnyvale, CA, USA
fYear
1994
fDate
1994
Firstpage
754
Abstract
Hydrogels containing weak acid or base pendant groups swell and release drugs differentially as a function of environmental pH and ionic strength. Also, the identity and concentration of buffering species in the release medium can affect swelling and drug release kinetics. A full understanding of factors affecting swelling and release would be reflected in a quantitative mathematical model of these processes. The authors develop a finite element computer model which predicts swelling and release profiles from spherical gels given specified values of mechanical and chemical parameters of the hydrogel, drug, and release medium. The code contains electromechanical and electrochemical components. Numerical computations based on a mathematical model predict gel swelling and stresses, charge density, solute concentrations, and solute and solvent fluxes. The model is validated by comparing its predictions with an experiment on controlled release of sodium salicylate
Keywords
electrokinetic effects; electromechanical effects; finite element analysis; gels; modelling; base pendant groups; charge density; chemical parameters; controlled drug release; environmental pH; finite element computer model; gel stresses; gel swelling; ionic strength; ionizable gels; mathematical model; mechanical parameters; numerical computations; sodium salicylate; solute concentration; solute flux; solvent flux; weak acid; Chemicals; Drugs; Electrokinetics; Kinetic theory; Mathematical model; Polymers; Predictive models; Solids; Solvents; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1994. Engineering Advances: New Opportunities for Biomedical Engineers. Proceedings of the 16th Annual International Conference of the IEEE
Conference_Location
Baltimore, MD
Print_ISBN
0-7803-2050-6
Type
conf
DOI
10.1109/IEMBS.1994.415276
Filename
415276
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