• DocumentCode
    2359149
  • Title

    Electrokinetics and electromechanics in controlled release from ionizable gels: theory & experiments

  • Author

    Sachs, Jeffrey R. ; Siegel, Ronald A.

  • Author_Institution
    Daniel H. Wagner & Associates, Sunnyvale, CA, USA
  • fYear
    1994
  • fDate
    1994
  • Firstpage
    754
  • Abstract
    Hydrogels containing weak acid or base pendant groups swell and release drugs differentially as a function of environmental pH and ionic strength. Also, the identity and concentration of buffering species in the release medium can affect swelling and drug release kinetics. A full understanding of factors affecting swelling and release would be reflected in a quantitative mathematical model of these processes. The authors develop a finite element computer model which predicts swelling and release profiles from spherical gels given specified values of mechanical and chemical parameters of the hydrogel, drug, and release medium. The code contains electromechanical and electrochemical components. Numerical computations based on a mathematical model predict gel swelling and stresses, charge density, solute concentrations, and solute and solvent fluxes. The model is validated by comparing its predictions with an experiment on controlled release of sodium salicylate
  • Keywords
    electrokinetic effects; electromechanical effects; finite element analysis; gels; modelling; base pendant groups; charge density; chemical parameters; controlled drug release; environmental pH; finite element computer model; gel stresses; gel swelling; ionic strength; ionizable gels; mathematical model; mechanical parameters; numerical computations; sodium salicylate; solute concentration; solute flux; solvent flux; weak acid; Chemicals; Drugs; Electrokinetics; Kinetic theory; Mathematical model; Polymers; Predictive models; Solids; Solvents; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1994. Engineering Advances: New Opportunities for Biomedical Engineers. Proceedings of the 16th Annual International Conference of the IEEE
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    0-7803-2050-6
  • Type

    conf

  • DOI
    10.1109/IEMBS.1994.415276
  • Filename
    415276