The probability design for wire bonding process by finite element and Monte Carlo method

Author

Wu, Huixian ; Xu, Yangjian ; Liang, Lihua ; Liu, Yong ; Martin, Stephen

Author_Institution

Fairchild-ZJUT Microelectron. Packaging Joint Lab., Zhejiang Univ. of Technol., Hangzhou, China

fYear

2010

fDate

26-28 April 2010

Firstpage

1

Lastpage

9

Abstract

In this paper, a numerical simulation-based parametric study on wire bonding is implemented by the probability method that combines the response surface strategy and the Monte Carlo random simulation method. The distribution probabilities of the peak stress values in metal and interlayer dielectric (ILD) stack layers are discussed with the variation of free air ball radius, Al pad thickness and ball bonding height in the wire bonding structure and the sensitivities of the output performances to the input variables are assessed. Finally, the major impact factors are determined for optimization of wire bonding.

Keywords

Monte Carlo methods; aluminium; finite element analysis; lead bonding; Al; Monte Carlo random simulation method; ball bonding height; distribution probabilities; finite element method; interlayer dielectric stack layers; numerical simulation-based parametric study; peak stress values; probability design; wire bonding process; wire bonding structure; Bonding processes; Dielectrics; Finite element methods; Input variables; Monte Carlo methods; Numerical simulation; Parametric study; Response surface methodology; Stress; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on

Conference_Location

Bordeaux

Print_ISBN

978-1-4244-7026-6

Type

conf

DOI

10.1109/ESIME.2010.5464529

Filename

5464529