Abstract :
The following topics are dealt with: electronics packaging technology including advanced packaging; electronics packaging materials; electronics packaging processes; interconnect technologies; electronics packaging quality & reliability; modeling & simulation; printed electronics; emerging technologies; wafer/package testing topics; and embedded packaging.
Keywords :
circuit reliability; circuit simulation; circuit testing; electronics packaging; interconnections; printed circuits; advanced packaging; electronics packaging materials; electronics packaging modeling; electronics packaging processes; electronics packaging quality; electronics packaging reliability; electronics packaging simulation; electronics packaging technology; embedded packaging; emerging technologies; interconnect technologies; package testing; printed electronics; wafer testing;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-8560-4
Electronic_ISBN :
978-1-4244-8561-1
DOI :
10.1109/EPTC.2010.5702719
