Title :
Optimization for simulation of WL-CSP subjected to Drop-Test with plasticity behavior
Author :
Le Coq, Cedric ; Tougui, Abdellah ; Stempin, Marie-Pascale ; Barreau, Laurent
Author_Institution :
STMicroelectronics, Tours, France
Abstract :
A simulation of the Board Level Drop-Test is performed to evaluate some WL-CSP (Wafer-Level Chip-Scale Packages) performances. An elastic-plastic model is applied on both solder bump and copper pad materials. It intends to demonstrate that copper plasticity is mandatory due to the large plastic strain occuring in these materials. A statistical analysis discusses the required accuracy for the modeling analysis. This analysis is combined with a components´ lifetime prediction based on a representative plastic strain. Finally, it is possible to do a relatively fast calculation while meeting the determined accuracy.
Keywords :
chip scale packaging; elasticity; life testing; plastic deformation; plasticity; wafer level packaging; WL-CSP; board level drop-test; elastic-plastic model; lifetime prediction; plastic strain; plasticity; solder bump; statistical analysis; wafer-level chip-scale packages; Creep; Fatigue; Mechanical engineering; Mechanical variables measurement; Microelectromechanical devices; Micromechanical devices; Radiofrequency microelectromechanical systems; Structural beams; Switches; Testing;
Conference_Titel :
Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on
Conference_Location :
Bordeaux
Print_ISBN :
978-1-4244-7026-6
DOI :
10.1109/ESIME.2010.5464593
