DocumentCode :
2361403
Title :
Overcoming the barriers to cleaning with bubble-free ozonated de-ionized water
Author :
Bush, Timothy M. ; Hardwick, Steven J. ; Wikol, Michael J.
Author_Institution :
W.L. Gore & Assoc. Inc., Elkton, MD, USA
fYear :
1998
fDate :
23-25 Sep 1998
Firstpage :
226
Lastpage :
229
Abstract :
The need for significant reductions in water consumption as 300 mm wafer processes are commercialized is driving the development of revolutionary new wet cleaning processes. Most of these new processes incorporate ozonated de-ionized water as a key processing step. The use of membrane contactors to infuse ozone into water uniquely enables the production of bubble-free de-ionized water. Bubble-free ozonated fluids are the critical enabling technology for the next generation of critical cleaning
Keywords :
bubbles; chemical technology; integrated circuit technology; membranes; ozone; surface cleaning; surface contamination; water; 300 mm; O3-H2O; bubble-free de-ionized water production; bubble-free ozonated de-ionized water; bubble-free ozonated fluids; cleaning; critical cleaning; critical enabling technology; membrane contactors; ozonated de-ionized water; ozone infusion; processing step; wafer processes; wafer size; water consumption; wet cleaning processes; Airports; Biomembranes; Chemical processes; Commercialization; Contactors; Green cleaning; Measurement units; Production; Water conservation; Water pollution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Conference_Location :
Boston, MA
ISSN :
1078-8743
Print_ISBN :
0-7803-4380-8
Type :
conf
DOI :
10.1109/ASMC.1998.731559
Filename :
731559
Link To Document :
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