• DocumentCode
    2361665
  • Title

    Low current (5 pA) resistive switching memory using high-к Ta2O5 solid electrolyte

  • Author

    Maikap, S. ; Rahaman, S.Z. ; Wu, T.Y. ; Chen, F. ; Kao, M.J. ; Tsai, M.J.

  • Author_Institution
    Dept. of Electron. Eng., Chang Gung Univ., Taoyuan, Taiwan
  • fYear
    2009
  • fDate
    14-18 Sept. 2009
  • Firstpage
    217
  • Lastpage
    220
  • Abstract
    Bipolar resistive switching memory device using high-kappa Ta2O5 solid electrolyte in a Cu/Ta2O5/W structure with the device sizes from 0.2-8 mum was investigated. This resistive memory device has a high threshold voltage of 0.75 V, high resistance ratio (RHigh/RLow) of 3times103, good endurance of > 103, and excellent retention at 150degC. The memory device with a low current operation of 5 pA is obtained, for the first time, owing to the Cu metallic chain formation in the high-kappa Ta2O5 solid electrolyte. The strong Cu chain formation is also confirmed by monitoring both the negative voltage and current observations. The low resistance state (RLow) decreases with increasing the current compliance from 5 pA to 700 muA, which can be useful for future multi-level data storage applications.
  • Keywords
    copper; solid electrolytes; tantalum compounds; tungsten; Cu-Ta2O5-W; bipolar resistive switching memory device; copper metallic chain formation; current 5 pA; current monitoring; device structure; high-kappa solid electrolyte; low-current resistive switching memory; multilevel data storage applications; negative voltage monitoring; size 0.2 mum to 8 mum; temperature 150 degC; CMOS technology; Copper; Electrodes; High K dielectric materials; High-K gate dielectrics; Industrial electronics; Memory; Monitoring; Solids; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 2009. ESSDERC '09. Proceedings of the European
  • Conference_Location
    Athens
  • ISSN
    1930-8876
  • Print_ISBN
    978-1-4244-4351-2
  • Electronic_ISBN
    1930-8876
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2009.5331517
  • Filename
    5331517