DocumentCode
2361665
Title
Low current (5 pA) resistive switching memory using high-к Ta2 O5 solid electrolyte
Author
Maikap, S. ; Rahaman, S.Z. ; Wu, T.Y. ; Chen, F. ; Kao, M.J. ; Tsai, M.J.
Author_Institution
Dept. of Electron. Eng., Chang Gung Univ., Taoyuan, Taiwan
fYear
2009
fDate
14-18 Sept. 2009
Firstpage
217
Lastpage
220
Abstract
Bipolar resistive switching memory device using high-kappa Ta2O5 solid electrolyte in a Cu/Ta2O5/W structure with the device sizes from 0.2-8 mum was investigated. This resistive memory device has a high threshold voltage of 0.75 V, high resistance ratio (RHigh/RLow) of 3times103, good endurance of > 103, and excellent retention at 150degC. The memory device with a low current operation of 5 pA is obtained, for the first time, owing to the Cu metallic chain formation in the high-kappa Ta2O5 solid electrolyte. The strong Cu chain formation is also confirmed by monitoring both the negative voltage and current observations. The low resistance state (RLow) decreases with increasing the current compliance from 5 pA to 700 muA, which can be useful for future multi-level data storage applications.
Keywords
copper; solid electrolytes; tantalum compounds; tungsten; Cu-Ta2O5-W; bipolar resistive switching memory device; copper metallic chain formation; current 5 pA; current monitoring; device structure; high-kappa solid electrolyte; low-current resistive switching memory; multilevel data storage applications; negative voltage monitoring; size 0.2 mum to 8 mum; temperature 150 degC; CMOS technology; Copper; Electrodes; High K dielectric materials; High-K gate dielectrics; Industrial electronics; Memory; Monitoring; Solids; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 2009. ESSDERC '09. Proceedings of the European
Conference_Location
Athens
ISSN
1930-8876
Print_ISBN
978-1-4244-4351-2
Electronic_ISBN
1930-8876
Type
conf
DOI
10.1109/ESSDERC.2009.5331517
Filename
5331517
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