Title :
1991 Proceedings. Eighth International IEEE VLSI Multilevel Interconnection Conference (Cat. No.91TH0359-0)
Abstract :
The following topics were dealt with: complete process realization; dielectric/conductor processes; novel structures; contact and via filling; reliability issues; conductor systems; test structures and modeling; dielectric planarization; step coverage; and dielectric processes
Keywords :
VLSI; circuit reliability; integrated circuit technology; metallisation; monolithic integrated circuits; vapour deposition; IC fabrication; contact filling; dielectric planarization; dielectric/conductor processes; modeling; reliability; step coverage; test structures; via filling;
Conference_Titel :
VLSI Multilevel Interconnection Conference, 1991, Proceedings., Eighth International IEEE
Conference_Location :
Santa Clara, CA, USA
Print_ISBN :
0-87942-673-X
DOI :
10.1109/VMIC.1991.152952
