DocumentCode
2363345
Title
Comparison of CBED and dark-field holography for strain mapping in nanostructures and devices
Author
Hÿtch, M.J. ; Houdellier, F. ; Claverie, A. ; Clément, L.
Author_Institution
CEMES, CNRS, Toulouse, France
fYear
2009
fDate
14-18 Sept. 2009
Firstpage
307
Lastpage
310
Abstract
A comparison is presented of the results obtained by two transmission electron microscopy (TEM) techniques, CBED and the new electron holographic technique HoloDark, on two selected structures in which the Si crystal has been stressed by two different means. First, we focus on a real transistor in which the Si channel is stressed by recessed SiGe source and drain, then, we report on results obtained on a flash memory structure in which the Si crystal is stressed by the presence of a Si3N4 liner grown on the Si surface. In homogenous media and highly symmetric structures, the CBED and HoloDark techniques give similar results for the measurement of deformations with about the same precision, in the 10-4 range. However, there are situations in which the HoloDark technique appears clearly superior. These include highly anisotropic media in which the relaxation of thin stressed samples may render the CBED technique inoperative. HoloDark offers a full mapping of the 2D strain tensor, including rotation and shear and gradients, without recourse to extensive modeling and simulation. HoloDark proves to be a technique of choice for strain measurements in real devices.
Keywords
MOSFET; anisotropic media; deformation; electron diffraction; electron holography; flash memories; nanoelectronics; nanostructured materials; semiconductor device measurement; silicon; strain measurement; transmission electron microscopy; 2D strain tensor; CBED technique; HoloDark; NMOS transistor; Si; Si3N4; anisotropic media; convergent-beam electron diffraction; dark-field holography; deformation measurement; electron holographic technique; flash memory structure; highly symmetric structures; homogenous media; nanostructures; silicon crystal; strain mapping; strain measurement; transmission electron microscopy; Anisotropic magnetoresistance; Capacitive sensors; Flash memory; Germanium silicon alloys; Holography; Nanostructures; Silicon germanium; Strain measurement; Tensile stress; Transmission electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 2009. ESSDERC '09. Proceedings of the European
Conference_Location
Athens
ISSN
1930-8876
Print_ISBN
978-1-4244-4351-2
Electronic_ISBN
1930-8876
Type
conf
DOI
10.1109/ESSDERC.2009.5331601
Filename
5331601
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