Title :
The design of new, Pb-free solder alloys with improved properties
Author :
McCormack, M. ; Jin, S. ; Kammlott, G.W.
Author_Institution :
AT&T Bell Labs., Murray Hill, NJ, USA
Abstract :
The goal of the research presented in this paper is to identify Pb-free alloys with melting temperatures close to or lower than that of the near-eutectic 40Pb-60Sn solder (melting point of 183°C), and that with the best mechanical properties. We have obtained substantially improved mechanical properties through manipulation of alloy microstructures. The following three alloys with superior mechanical properties are discussed: i) Sn-3.5%Ag-1%Zn-0.5%Cu with a melting point of ~216°C, ii) Sn-8%Zn-5%In-(0.1-0.5%)Ag with a melting point of ~187°C, and iii) 54.5%Bi-45%Sn-0.5%Ag with a melting point of ~140°C
Keywords :
bismuth alloys; copper alloys; ductility; indium alloys; mechanical strength; melting point; silver alloys; soldering; tin alloys; zinc alloys; 140 degC; 187 degC; 216 degC; BiSnAg; SnAgZnCu; SnZnInAg; alloy microstructures; ductility; mechanical properties; melting temperatures; solder alloys; Electronic components; Electronics packaging; Manufacturing processes; Material properties; Mechanical factors; Microstructure; Modems; Soldering; Technological innovation; Temperature;
Conference_Titel :
Electronics and the Environment, 1995. ISEE., Proceedings of the 1995 IEEE International Symposium on
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-2137-5
DOI :
10.1109/ISEE.1995.514970
