Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes

Author

Nai, S.M.L. ; Gupta, M. ; Wei, J.

Author_Institution

Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore

fYear

2008

fDate

24-27 March 2008

Firstpage

15

Lastpage

19

Abstract

In the present study, multi-walled carbon nanotubes (CNTs) were incorporated into SnAgCu solder matrix, to form composite solders. Isothermal aging study was performed on solder, joints, to investigate the formation and growth of the intermetallic compound (IMC) layer at the solder/metallization interface. Results revealed that after soldering, the initial interfacial IMC thickness of the unreinforced solder joint was comparable to that of the composite solder joints. However, after aging, the interfacial IMC layer of the unreinforced solder joint was observed to grow more significantly than that of the composite solder joints. Furthermore, the composite solder joints exhibited lower diffusion coefficient and this indicated that the presence of CNTs was effective in retarding the growth of the IMC layer.

Keywords

ageing; carbon nanotubes; copper alloys; nanotube devices; silver alloys; solders; tin alloys; SnAgCu solder joints; SnAgCu-C; diffusion coefficient; interfacial IMC thickness; isothermal aging; multi-walled carbon nanotubes; Carbon nanotubes; Intermetallic; Nanoelectronics; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1572-4

Electronic_ISBN

978-1-4244-1573-1

Type

conf

DOI

10.1109/INEC.2008.4585428

Filename

4585428