Title :
Adhesive Bonding Process Development for Planar Lightwave Circuit in Optical Transceiver Assembly
Author :
Liang, Cai ; Zhou, Xiaofeng ; Zhang, Fajian
Author_Institution :
Samuel Ginn Coll. of Eng., Auburn Univ., AL
Abstract :
Glass based planar lightwave circuit (PLC) is one of the core components employed in optical transceiver operation. Assembly of PLC onto a silicon optical bench (SiOB) is a crucial step, since it requires actively aligning the PLC to both a laser diode and an optical fiber. We have successfully developed an adhesive bonding process for buried type planar glass wave-guide circuit assembly in optical transceiver packaging with the powerful design optimal experiment tool. A dosage of 280j/cm2 with intensity of 15000mw/cm2 UV curing followed by 15 minutes 110degC thermal cure process is able to achieve 0.2dB optical coupling power loss for PLC-fiber assembly
Keywords :
adhesive bonding; curing; glass; optical fibres; optical planar waveguides; optical receivers; optical transmitters; semiconductor lasers; 110 C; 15 mins; adhesive bonding; laser diode; optical fiber; optical transceiver; planar glass waveguide circuit; planar lightwave circuit; ultraviolet curing; Assembly; Bonding processes; Circuits; Diode lasers; Glass; Optical devices; Optical fibers; Programmable control; Silicon; Transceivers; DOE; PLC; SiOB; UV Cure; active alignment; adhesive bonding; optical transceiver; passive alignment;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
Conference_Location :
Atlanta, GA
Print_ISBN :
1-4244-0260-3
DOI :
10.1109/ISAPM.2006.1665982
