DocumentCode
2365899
Title
Thin FC film for sidewall passivation in SCREAM process for MEMS
Author
Vrtacnik, D. ; Resnik, D. ; Aljancic, U. ; Mozek, M. ; Penic, S. ; Amon, S.
fYear
2007
fDate
26-28 Sept. 2007
Firstpage
1
Lastpage
5
Abstract
SCREAM process for releasing micromechanical MEMS structures using plasma polymerized fluorocarbon thin film for trench sidewall passivation is reported. The developed process is designed as a one mask process, and all etchings and depositions are fabricated in the same etching system (standard capacitive coupled RIE), as one-step-one-run process.
Keywords
etching; masks; micromechanical devices; passivation; polymer films; FC film; MEMS; SCREAM process; mask process; micromechanical MEMS structures; one-step-one-run process; plasma polymerized fluorocarbon thin film; single-crystal reactive etching and metallization; standard capacitive coupled RIE; trench sidewall passivation; Electrodes; Etching; Micromechanical devices; Optical films; Passivation; Plasma applications; Plasma temperature; Polymer films; Silicon; Sputtering; MEMS; RIE; SCREAM; comb structure thin films; fluorocarbon; passivation;
fLanguage
English
Publisher
ieee
Conference_Titel
AFRICON 2007
Conference_Location
Windhoek
Print_ISBN
978-1-4244-0987-7
Electronic_ISBN
978-1-4244-0987-7
Type
conf
DOI
10.1109/AFRCON.2007.4401632
Filename
4401632
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