Memory Packaging Material and Assembly Trends

Author

Koh, Wei

Author_Institution

Kingston Technol. Co.

fYear

0

fDate

0-0 0

Firstpage

64

Lastpage

68

Abstract

This paper reviews the packaging designs available for DRAM DIMM modules and miniaturized, removable digital flash cards using NAND chips. For present day DRAM modules the packages are switching from leadframe types to chip scale packages (CSP). For the flash cards leadframe packages, CSP and chip on board (COB) are all being applied, depending on the card type and size. Current and future module and card design and their assembly trends are discussed. Due to lead-free requirements, all packages and materials must meet the high reflow temperature conditions used for lead-free assembly

Keywords

DRAM chips; assembling; chip scale packaging; flash memories; DRAM DIMM modules; NAND chips; assembly trends; chip on board; chip scale packages; lead frame packaging; lead-free assembly; memory packaging material; packaging designs; reflow temperature conditions; removable digital flash cards; Assembly; Chip scale packaging; Costs; Environmentally friendly manufacturing techniques; Lead; Random access memory; SDRAM; Semiconductor device packaging; Substrates; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on

Conference_Location

Atlanta, GA

ISSN

1550-5723

Print_ISBN

1-4244-0260-3

Type

conf

DOI

10.1109/ISAPM.2006.1665999

Filename

1665999