Identification of electrical over stress failures from other package related failures using package delamination signatures

Author

Li, Susan ; Lee, Kenneth ; Hulog, Jose ; Kazmi, S. ; Yin, Shaw ; Pollock, Jeff

Author_Institution

Adv. Micro Devices Inc., Sunnyvale, CA, USA

fYear

1996

fDate

10-12 Sept. 1996

Firstpage

95

Lastpage

100

Abstract

EOS failures can be quickly distinguished from other package-related failures by understanding their unique delamination signatures. The scanning acoustic microscope is a powerful tool for nondestructively detecting package delamination. The case study showed that using these signatures can differentiate EOS failures from other package-related failures at an early stage of the failure analysis.

Keywords

acoustic microscopy; delamination; electrostatic discharge; failure analysis; integrated circuit measurement; integrated circuit packaging; integrated circuit testing; nondestructive testing; plastic packaging; EOS failures; IC packaging; electrical over stress failures; failure analysis; nondestructive detection; package delamination signatures; package related failures; package-related failures; scanning acoustic microscope; Acoustic microscopy; Electrostatic discharges; Failure analysis; Integrated circuit measurements; Integrated circuit packaging; Integrated circuit testing; Nondestructive testing; Plastic packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Overstress/Electrostatic Discharge Symposium, 1996. Proceedings

Print_ISBN

1-878303-69-4

Type

conf

DOI

10.1109/EOSESD.1996.865130

Filename

865130