DocumentCode
2366522
Title
Post Buckling Analysis of Thin Membrane for the Flexible Electronics
Author
Park, Seungbae ; Gao, Jia ; Agrawal, Deepak ; Pitarresi, James ; Homentcovsch, Dorel
Author_Institution
Dept. of Mech. Eng., New York State Univ., Binghamton, NY
fYear
0
fDate
0-0 0
Firstpage
145
Lastpage
145
Abstract
This paper presents the experiment work and numerical solution to investigate wrinkle formation and evolution in thin membranes at elevated temperatures. The specimens consist of Kapton circular membranes supported on steel substrate. The membranes were heated from room temperature to 100deg. The DIC (digital image correlation) was used to monitor the profiles of membranes at discrete temperatures. The nonlinear post buckling analysis was used for numerical study of membrane wrinkling. The nonlinear post buckling solution shows that the global buckling of membrane significantly reduces bending stiffness thus to create localized buckling modes accounting for the wrinkle generation. The wrinkle evolution is stable until the temperature reaches the next critical value. After this critical temperature, the wrinkle evolution is accelerated until the final temperature. The finite element simulation results are consistent with experimental observations
Keywords
bending; buckling; finite element analysis; flexible electronics; image processing; membranes; substrates; 100 C; Kapton circular membranes; bending stiffness; digital image correlation; finite element simulation; flexible electronics; nonlinear post buckling; post buckling analysis; thin membrane; wrinkle evolution; wrinkle formation; Acceleration; Biomembranes; Digital images; Finite element methods; Flexible electronics; Mechanical engineering; Monitoring; Steel; Temperature; USA Councils;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
Conference_Location
Atlanta, GA
ISSN
1550-5723
Print_ISBN
1-4244-0260-3
Type
conf
DOI
10.1109/ISAPM.2006.1666024
Filename
1666024
Link To Document