• DocumentCode
    2367945
  • Title

    Defect oriented fault analysis for SRAM

  • Author

    Huang, Rei-Fu ; Chou, Yung-Fa ; Wu, Cheng-Wen

  • Author_Institution
    Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2003
  • fDate
    16-19 Nov. 2003
  • Firstpage
    256
  • Lastpage
    261
  • Abstract
    Fault analysis is an important step in establishing detailed fault models or subsequent diagnostics and debugging of a semiconductor memory product. We have performed defect injection in the memory cell array of an industrial SRAM circuit and analyzed the faulty behavior with respect to each defect injected. We found that although some of the defects can be mapped to existing fault models, there are many defects that result in unmodeled faults. Moreover, a defect may exhibit a different faulty behavior at a different location in the cell array. The voltage and temperature parameters can also change the faulty behavior. The simulation results show that almost all open and short defects lead to stuck-at faults, transition faults, and data retention faults.
  • Keywords
    CMOS memory circuits; SRAM chips; fault simulation; integrated circuit testing; system-on-chip; CMOS cell layout; SOC; SRAM; data retention faults; debugging; defect injection; defect oriented fault analysis; embedded memories; fault models; memory cell array; open defects; short defects; stuck-at faults; temperature parameters; transition faults; voltage parameters; CMOS memory integrated circuits; Circuit faults; Circuit simulation; Circuit testing; Debugging; Integrated circuit testing; MOS devices; Random access memory; SRAM chips; Semiconductor memory; Switches; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Symposium, 2003. ATS 2003. 12th Asian
  • ISSN
    1081-7735
  • Print_ISBN
    0-7695-1951-2
  • Type

    conf

  • DOI
    10.1109/ATS.2003.1250819
  • Filename
    1250819