DocumentCode
2368321
Title
A processor-based built-in self-repair design for embedded memories
Author
Su, Chin-Lung ; Huang, Rei-Fu ; Wu, Cheng-Wen
Author_Institution
Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear
2003
fDate
16-19 Nov. 2003
Firstpage
366
Lastpage
371
Abstract
We propose an embedded processor-based built-in self-repair (BISR) design for embedded memories. In the proposed design we reuse the embedded processor that can be found on almost every system-on-chip (SOC) product, in addition to many distinct features. By reusing the embedded processor, the controller and redundancy analysis circuit of a typical BISR design can be removed. Also, the test algorithm and redundancy analysis/allocation algorithm are easily programmable, greatly increasing the design flexibility. We also have developed a memory wrapper that allows at-speed testing of the memory cores. The area overhead of the proposed BISR scheme is low, since only the memory wrapper needs to be realized explicitly. Our experiments show that the BISR area overhead for a typical 8 K×32 SRAM is lower than 1%.
Keywords
SRAM chips; built-in self test; integrated circuit design; logic design; logic testing; system-on-chip; 262144 bit; 32 bit; BISR; SOC; SRAM; embedded memories; embedded processors; memory core at-speed testing; memory wrapper; processor-based built-in self-repair design; redundancy analysis/allocation; system-on-chip; test algorithm; Algorithm design and analysis; Automatic testing; Built-in self-test; Circuit faults; Circuit testing; Integrated circuit design; Laboratories; Logic circuit testing; Logic design; Manufacturing; Process design; Redundancy; SRAM chips; Self-testing; System-on-a-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Symposium, 2003. ATS 2003. 12th Asian
ISSN
1081-7735
Print_ISBN
0-7695-1951-2
Type
conf
DOI
10.1109/ATS.2003.1250838
Filename
1250838
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