Improved heat-dissipating silicone by Nano-materials for LED packaging

Author

Cao, M.L. ; Pang, F.Y. ; Zhang, M.C. ; Cheng, Z.J. ; Gao, Y. ; He, P.G. ; Pane, L.K. ; Sun, Z.

Author_Institution

Dept. of Chem., East China Normal Univ., Shanghai

fYear

2008

fDate

24-27 March 2008

Firstpage

758

Lastpage

760

Abstract

Nano-diamond particles with the size of 5 nm were dispersed into silicone materials to form diamond/silicone nano-composite films. The films were characterized with scanning electron microscopy, UV-visible optical transmittance spectroscopy, and hot disk thermal constant analysis instrument. The results showed that the thermal conductivity of silicone was enhanced twice without much sacrifice of transmittance when silicone was doped with 0.02% nano-diamond particles.

Keywords

cooling; electronics packaging; light emitting diodes; nanocomposites; thermal conductivity; LED packaging; UV-visible optical transmittance spectroscopy; diamond-silicone nanocomposite films; heat-dissipating silicone; hot disk thermal constant analysis instrument; nanodiamond particles; nanomaterials; scanning electron microscopy; thermal conductivity; Conducting materials; Electron optics; Light emitting diodes; Optical films; Optical materials; Optical microscopy; Packaging; Scanning electron microscopy; Semiconductor films; Thermal conductivity; LED packaging; Nano-diamond; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International

Conference_Location

Shanghai

Print_ISBN

978-1-4244-1572-4

Electronic_ISBN

978-1-4244-1573-1

Type

conf

DOI

10.1109/INEC.2008.4585595

Filename

4585595