• DocumentCode
    236876
  • Title

    Practical de-embedding solution for PoP devices using a transfer function methodology

  • Author

    Romo, G. ; Powers, Sarah ; Michalka, Tim ; Jasdanwala, Saifee

  • Author_Institution
    Power & Signal Integrity Group, Qualcomm Technol., Inc., San Diego, CA, USA
  • fYear
    2014
  • fDate
    4-8 Aug. 2014
  • Firstpage
    406
  • Lastpage
    411
  • Abstract
    This paper presents a de-embedding methodology based on transfer function concepts applicable to probed measurements performed on PoP configurations for a highperformance SoC. This methodology is applied for recovering signals at the receiver´s IO pads in a mission-mode configuration, from those measured at probe points in a probing configuration in real-time. It also offers physical insight into the interposer´s performance thus allowing for solution space exploration and meaningful comparisons of the two different interposer technologies to be presented.
  • Keywords
    integrated circuit packaging; system-on-chip; transfer functions; PoP configurations; PoP devices; SoC; de-embedding solution; interposer technology; mission-mode configuration; package-on-package; solution space exploration; transfer function methodology; Correlation; Integrated circuit modeling; Probes; Random access memory; Resistance; System-on-chip; Transfer functions; SoC; de-embedding; package-on-package (PoP); probing; transfer functions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on
  • Conference_Location
    Raleigh, NC
  • Print_ISBN
    978-1-4799-5544-2
  • Type

    conf

  • DOI
    10.1109/ISEMC.2014.6899006
  • Filename
    6899006