DocumentCode :
2368854
Title :
Impact of channel engineering on unity gain frequency and noise-figure in 90nm NMOS transistor for RF applications
Author :
Srinivasan, R. ; Bhat, Navakanta
Author_Institution :
Dept. of Electr. & Comput. Eng., Indian Inst. of Sci., Bangalore, India
fYear :
2005
fDate :
3-7 Jan. 2005
Firstpage :
392
Lastpage :
396
Abstract :
In this paper, we have studied and compared the RF performance metrics, unity gain frequency (ft) and noise figure (NF), of the devices with channel engineering consisting of halo and super steep retrograde channel (SSRC) implants, and the devices with uniform channel doping concentration, using process, device, and mixed mode simulations. The simulation results show that at 90nm gate lengths, for a given off-state leakage constraint (IOFF), devices with uniform channel doping concentration deliver higher ft and lower NF than the devices which used halo and SSRC, due to better sub-threshold slope and transconductance. However, at 0.25 μm technology the same is not true. Therefore, in the 90 nm devices uniform channel doping profile is recommended to get better RF performance.
Keywords :
MOSFET; doping profiles; radiofrequency integrated circuits; semiconductor device models; semiconductor doping; 90 nm; NMOS transistor; RF performance metrics; channel engineering; gate lengths; mixed mode simulations; noise figure; off-state leakage constraint; subthreshold slope; super steep retrograde channel; transconductance; uniform channel doping concentration; unity gain frequency; Doping profiles; Implants; MOSFET circuits; Noise figure; Noise measurement; Performance gain; Radio frequency; Space technology; Transconductance; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Design, 2005. 18th International Conference on
ISSN :
1063-9667
Print_ISBN :
0-7695-2264-5
Type :
conf
DOI :
10.1109/ICVD.2005.107
Filename :
1383307
Link To Document :
بازگشت