DocumentCode :
2368899
Title :
Fabrication of AlGaN/GaN HFET with a high breakdown voltage of over 1050 V
Author :
Yoshida, Sigeru ; Jiang Li ; Takehara, Hironari ; Kambayashi, H. ; Ikeda, N.
Author_Institution :
Yokohama R&D Labs., Furukawa Electr. Co., Ltd, Yokohama
fYear :
2006
fDate :
4-8 June 2006
Firstpage :
1
Lastpage :
4
Abstract :
We performed an AlGaN/GaN Schottky barrier diode (SBD) with a high breakdown voltage of over 1000V on Si (111) substrate. An AlGaN/GaN heterostructure without any crack was realized on a Si (111) substrate using a metalorganic chemical vapor deposition (MOCVD). We also fabricated an AlGaN/GaN heterojunction field effect transistor (HFET) using an AlGaN/GaN heterostructure on a Si (111) substrate. The fabrication process was the same as SBD. The gate length and width were 2000 nm and 0.4 mm, respectively. The distance of gate and drain was 15000 nm. The off-state breakdown voltage of the HFET was over 1050V
Keywords :
III-V semiconductors; MOCVD; Schottky diodes; aluminium compounds; gallium compounds; power field effect transistors; semiconductor device breakdown; silicon; wide band gap semiconductors; 0.4 mm; 2000 nm; AlGaN-GaN-Si; HFET; Schottky barrier diode; breakdown voltage; heterojunction field effect transistor; metalorganic chemical vapor deposition; Aluminum gallium nitride; Chemical vapor deposition; Fabrication; Gallium nitride; HEMTs; Heterojunctions; MOCVD; MODFETs; Schottky barriers; Schottky diodes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and IC's, 2006. ISPSD 2006. IEEE International Symposium on
Conference_Location :
Naples
Print_ISBN :
0-7803-9714-2
Type :
conf
DOI :
10.1109/ISPSD.2006.1666135
Filename :
1666135
Link To Document :
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