DocumentCode :
2369430
Title :
Research on EVA-inorganic nanocomposites
Author :
Wanxi, Zhang ; Chunxiao, Zhang ; Hongji, Li
Author_Institution :
Dalian Univ. of Technol., Changchun
fYear :
2008
fDate :
24-27 March 2008
Firstpage :
979
Lastpage :
984
Abstract :
In recent years, polymer/inorganic nanocomposites have already attracted the interests. In this paper, EVA/inorganic nanocomposites of direct-dispersed, one-step and two-step were prepared by melt blending. The preparation, morphological Structure and mechanical properties of these composites were systematically investigated, which laid the foundations for the further experimental. The dispersibility of nanoparticles in EVA matrix was characterized by FESEM and FT-IR In all the composite systems, one-step improves the mechanical properties more than direct dispersed and two-step methods; Proper filling of nanoparticles by one-step may decrease the apparent viscosity of the systems; There has a interface bonding layer between EVA and nanoparticles by Vinyl Triethoxyl Silane coupling agent, adjusting the bonding structure between phases; nanocomposites have nano-scale dispersions.
Keywords :
Fourier transform spectra; bonds (chemical); elongation; field emission electron microscopy; filled polymers; melt processing; nanocomposites; nanoparticles; nanotechnology; plastic flow; polymer blends; scanning electron microscopy; tensile strength; FESEM; FTIR spectra; apparent viscosity; bonding structure; coupling agent; elongation; ethylene-vinylacetate copolymers; interface bonding; mechanical properties; melt blending; nanocomposites; nanoparticle dispersibility; tensile strength; vinyl triethoxyl silane; Nanocomposites; Nanoelectronics; dispersion morphology; ethylene/vinyl acetate (EVA); mechanical properties; nanocomposites; preparation method;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1572-4
Electronic_ISBN :
978-1-4244-1573-1
Type :
conf
DOI :
10.1109/INEC.2008.4585649
Filename :
4585649
Link To Document :
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