• DocumentCode
    2369769
  • Title

    Thruchip interface (TCI) for 3D integration of low-power system

  • Author

    Kuroda, Tadahiro

  • Author_Institution
    Keio Univ., Yokohama, Japan
  • fYear
    2010
  • fDate
    6-8 Dec. 2010
  • Abstract
    This paper presents a counterpart of TSV and a circuit solution that enables 3D integration of power-aware systems. It bears comparison with TSV in performance but less expensive.
  • Keywords
    low-power electronics; three-dimensional integrated circuits; TCI; TSV; circuit solution; low-power system 3D integration; thruchip interface;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2010 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0163-1918
  • Print_ISBN
    978-1-4424-7418-5
  • Electronic_ISBN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.2010.5703378
  • Filename
    5703378
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2369769