Title :
Thermal-aware design of 3D ICs with inter-tier liquid cooling
Author_Institution :
Embedded Syst. Lab. (ESL), Ecole Polytech. Fed. de Lausanne (EPFL), Lausanne, Switzerland
Abstract :
Microchannel-based liquid cooling is a promising technology solution to overcome the thermal challenges of 3D MPSoCs. However, intelligent control of the coolant flow rate is needed to avoid wasted energy consumption for over-cooling the system when the system is under-utilized. Therefore, this paper proposes a novel system-level thermal-aware design as an affective method to achieve thermally-balanced 3D MPSoCs.
Keywords :
integrated circuit design; multiprocessing systems; system-on-chip; thermal management (packaging); three-dimensional integrated circuits; 3D IC; 3D MPSoC; coolant flow rate; intertier liquid cooling; microchannel-based liquid cooling; system-level thermal-aware design;
Conference_Titel :
Electron Devices Meeting (IEDM), 2010 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4424-7418-5
Electronic_ISBN :
0163-1918
DOI :
10.1109/IEDM.2010.5703379
