DocumentCode
2369787
Title
Performances of coupled interconnect lines: the impact of inductance and routing orientation
Author
Deschacht, D. ; Lopez, A.
Author_Institution
Lab. d´´Informatique, de Robotique etde Microelectronique de Montpellier, UMR CNRS, Montpellier, France
fYear
2005
fDate
3-7 Jan. 2005
Firstpage
640
Lastpage
643
Abstract
In this paper we show the influence of inductance and routing orientation on timing performances by considering two configurations of parallel coupled interconnects, one with both drivers on the same side, and the other with the drivers in opposite directions. For a typical DSM (deep-sub-micron) process, we show that when analyzing VLSI circuits, if standard distributed RC models are used, and inductive effects and routing orientation are ignored, large errors can occur in the prediction and evaluation of the circuit behavior. Both greatly affect circuit performances: the discrepancy rates can reach 20% and 18% respectively for the latency and 50% and 30% for the output switching delay. The routing orientation can lead to a difference of 18% for the latency and 35% for the output transition time when the two lines have the same transitions.
Keywords
RC circuits; VLSI; driver circuits; inductance; integrated circuit interconnections; integrated circuit modelling; network routing; timing; VLSI circuits; circuit behavior; circuit performances; coupled interconnect lines; deep-sub-micron process; distributed RC models; inductive effects; routing orientation; switching delay; timing performances; Circuit analysis; Coupling circuits; Delay; Driver circuits; Inductance; Integrated circuit interconnections; Predictive models; Routing; Timing; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, 2005. 18th International Conference on
ISSN
1063-9667
Print_ISBN
0-7695-2264-5
Type
conf
DOI
10.1109/ICVD.2005.135
Filename
1383346
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