• DocumentCode
    2370239
  • Title

    Methodologies for size, and temperature dependent change of materials properties

  • Author

    Gu, Mingxia ; Sun, Chang Q. ; Tan, Cher Mig ; Wang, Shanzhong

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
  • fYear
    2008
  • fDate
    24-27 March 2008
  • Firstpage
    1167
  • Lastpage
    1186
  • Abstract
    With the miniaturization of a solid down to nanometers scale, the mechanical and optical properties of such nanomaterials are different from that of their corresponding bulk materials. A systematic understanding of the atomic origin of the unusual behavior of mechanical and optical properties of a nanosolid is presented here towards the predictions for design and controllable growth of nanostructured materials. The Local Bond Average (LBA) approximation and bond-order-length-strength (BOLS) correlation mechanism in size, temperature and pressure domain has been developed, which enables the tunability of various measurable properties, such as elastic constants, optical phonon frequency shift. Agreement between predictions and observations reveal that the shortened and strengthened surface bonds are responsible for the observed size dependent change of material properties, while the temperature induced bond expansion and weakening are the physical origin for the temperature dependent change of measurable material properties.
  • Keywords
    elastic constants; nanostructured materials; phonons; bond expansion; bond-order-length-strength correlation; controllable growth; elastic constants; local bond average approximation; nanosctructured materials; optical phonon frequency shift; surface bonds; Atom optics; Bonding; Material properties; Mechanical factors; Nanomaterials; Nanostructured materials; Optical materials; Size measurement; Solids; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1572-4
  • Electronic_ISBN
    978-1-4244-1573-1
  • Type

    conf

  • DOI
    10.1109/INEC.2008.4585690
  • Filename
    4585690