DocumentCode
2370239
Title
Methodologies for size, and temperature dependent change of materials properties
Author
Gu, Mingxia ; Sun, Chang Q. ; Tan, Cher Mig ; Wang, Shanzhong
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
fYear
2008
fDate
24-27 March 2008
Firstpage
1167
Lastpage
1186
Abstract
With the miniaturization of a solid down to nanometers scale, the mechanical and optical properties of such nanomaterials are different from that of their corresponding bulk materials. A systematic understanding of the atomic origin of the unusual behavior of mechanical and optical properties of a nanosolid is presented here towards the predictions for design and controllable growth of nanostructured materials. The Local Bond Average (LBA) approximation and bond-order-length-strength (BOLS) correlation mechanism in size, temperature and pressure domain has been developed, which enables the tunability of various measurable properties, such as elastic constants, optical phonon frequency shift. Agreement between predictions and observations reveal that the shortened and strengthened surface bonds are responsible for the observed size dependent change of material properties, while the temperature induced bond expansion and weakening are the physical origin for the temperature dependent change of measurable material properties.
Keywords
elastic constants; nanostructured materials; phonons; bond expansion; bond-order-length-strength correlation; controllable growth; elastic constants; local bond average approximation; nanosctructured materials; optical phonon frequency shift; surface bonds; Atom optics; Bonding; Material properties; Mechanical factors; Nanomaterials; Nanostructured materials; Optical materials; Size measurement; Solids; Temperature dependence;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1572-4
Electronic_ISBN
978-1-4244-1573-1
Type
conf
DOI
10.1109/INEC.2008.4585690
Filename
4585690
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