• DocumentCode
    237033
  • Title

    Effect of narrow power fills on PCB PDN noise

  • Author

    Shringarpure, Ketan ; Biyao Zhao ; Archambeault, Bruce ; Ruehli, Albert ; Jun Fan ; Drewniak, James

  • Author_Institution
    EMC Lab., Missouri Univ. of Sci. & Technol. Rolla, Rolla, MO, USA
  • fYear
    2014
  • fDate
    4-8 Aug. 2014
  • Firstpage
    839
  • Lastpage
    844
  • Abstract
    The printed circuit board (PCB) power delivery network (PDN) performance has become critical with the reducing margins on power noise. This paper deals with a specific question about the size of the power area fill used to route the power current from the dc regulator to integrated circuit(IC), and also used for connecting to the decoupling capacitors. With increased PCB real estate costs, narrow power fills are required, which results in an increase in the connection inductance of decoupling capacitors. This paper uses a proven lumped circuit model extraction procedure, based on the first principle resonant cavity model, to demonstrate the effect of narrow and wide area fills used in typical PCB PDN designs. The frequency domain results thus obtained are used with typical IC current draw profiles to show the impact on the noise voltage developed at the IC. Some design guidelines and conclusions are drawn from these results.
  • Keywords
    capacitors; distribution networks; integrated circuit noise; lumped parameter networks; printed circuits; PCB PDN noise; dc regulator; decoupling capacitors; frequency domain; integrated circuit; lumped circuit model extraction procedure; power area fill size; power current; power delivery network; principle resonant cavity model; printed circuit board; Capacitors; Cavity resonators; Geometry; Impedance; Inductance; Integrated circuit modeling; PDN noise; Power distribution network design; narrow area fills;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on
  • Conference_Location
    Raleigh, NC
  • Print_ISBN
    978-1-4799-5544-2
  • Type

    conf

  • DOI
    10.1109/ISEMC.2014.6899084
  • Filename
    6899084