A Novel Via-less Vertical Integration Method for MEMS Scanned Phased Array Modules

A highly integrated electronically scanned phased array (ESPA) module using an innovative integration approach with MEMS processing technologies is presented. X-band monolithic 3-bit MEMS phase shifters, Wilkinson power dividers and via-less capacitive interconnects are integrated on a double-sided wafer to produce the prototype module. In order to fully integrate these components, finite ground coplanar (FGC) waveguide MEMS components are employed for the very first time without the use of interconnect vias or complex multi-layer processing. The 0.37 in²-integrated module has a bandwidth of 11% and is an enabling building block of integrated sub-system arrays for lightweight large space-based phased arrays.