• DocumentCode
    2375455
  • Title

    Bending and twisting of 96.5Sn3.5Ag and 97.5Pb2.5Sn solder interconnects with creep

  • Author

    Lau, John H.

  • Author_Institution
    Hewlett-Packard Co., Palo Alto, CA, USA
  • fYear
    1994
  • fDate
    1-4 May 1994
  • Firstpage
    1108
  • Lastpage
    1114
  • Abstract
    An exact analysis is presented for the creep deformation of a thin-walled circular solder cylinder under the simultaneous actions of bending and twisting moments. Dimensionless interaction curves and charts which relate the variables, interconnect geometry, solder material properties, bending moment, twisting moment, curvature rate, and twist rate are also provided for engineering practice convenience. The constitutive relationship of the 97.5Pb2.5Sn and 96.5Sn3.5Ag solder interconnects is described by the Garofalo-Arrhenius steady-state creep equation
  • Keywords
    bending; creep; lead alloys; silver alloys; soldering; tin alloys; Garofalo-Arrhenius steady-state creep equation; Pb97.5Sn2.5; Sn96.5Ag3.5; bending moment; creep deformation; curvature rate; dimensionless interaction curves; interconnect geometry; solder interconnects; solder material properties; thin-walled circular solder cylinder; twist rate; twisting moment; Capacitive sensors; Creep; Engine cylinders; Equations; Milling machines; Steady-state; Temperature dependence; Tensile stress; Thin wall structures; Uniaxial strain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1994. Proceedings., 44th
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-0914-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1994.367493
  • Filename
    367493
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2375455