Title :
Low distortion cold rolled clad sheets for mounting material
Author :
Ozawa, Shinji ; Yoshida, Kazuo ; Okamoto, Hiroaki ; Saijo, Kinji
Author_Institution :
Toyo Kohan Co. Ltd., Yamaguchi, Japan
Abstract :
A new cladding process has been developed by means of a surface activated bonding technique. The metal sheets to be bonded are cleaned by Ar plasma ion etching activated and rolled with low distortion at room temperature in vacuum. In many respects, the clad sheets manufactured by this process have advantages over conventional clad sheets. For instance, they have a clean and flat interface without intermetallic alloy layer. Thin metal foil (10 μm~thickness) can be bonded with the metal sheet. The multi layer clad sheet produced by this process can be formed easily by selective chemical etching method Therefore, the sheet makes it possible to design a fine and solid conductive circuit with bump only through the chemical etching process
Keywords :
brazing; cold rolling; environmental factors; integrated circuit bonding; integrated circuit packaging; metallic thin films; printed circuit manufacture; sputter etching; 10 μm thickness; 10 micron; AI/SUS304 clad; Ar plasma ion etching; chemical etching; clad sheets; cladding; flat interface; intermetallic allay layer; metal sheets; solid conductive circuit; surface activated bonding; thin metal foil; Argon; Bonding; Chemical processes; Etching; Manufacturing processes; Plasma applications; Plasma materials processing; Plasma temperature; Sheet materials; Surface cleaning;
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 2001. Proceedings EcoDesign 2001: Second International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
0-7695-1266-6
DOI :
10.1109/.2001.992515
