Title :
Ball semiconductor process and material
Author :
Yoshida, Masataka
Author_Institution :
Ball Semicond. Inc., Allen, TX, USA
Abstract :
With l mm being the largest, BALL Semiconductor Inc. plans to continue development of 0.5 mm diameter and smaller to maximize the material and resource usage. This movement shall reduce chemical and gas usages as well, which will help in creating cleaner manufacturing processes
Keywords :
MOS integrated circuits; environmental factors; integrated circuit technology; micromechanical devices; semiconductor technology; 0.5 mm; 0.5 mm diameter; Ball Technology; IC technology; MEMS technology; NMOS integrated circuit; cleaner manufacturing processes; lmm; resources; semiconductor industry; spherical shape; symmetrical 3D structure; Chemical technology; Circuit topology; Cooling; Fabrication; Heating; Integrated circuit technology; Mechanical systems; Micromechanical devices; Semiconductor materials; Shape;
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 2001. Proceedings EcoDesign 2001: Second International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
0-7695-1266-6
DOI :
10.1109/.2001.992518
