Title :
Analysis of TAB inner lead fatigue in thermal cycle environments
Author_Institution :
Honeywell Inc., Phoenix, AZ, USA
Abstract :
The inner leads of a Tape Automated Bonding (TAB) device can be subject to early fatigue failures in thermal cycle environments. This paper describes a 3-D non-linear finite element analysis of the failure mechanism, and verifies the results by experiment. Some TAB applications require environmental qualification and electrical testing in the unexcised tape carrier or retain a significant portion of the polyimide tape in the assembly. In these cases the Coefficient of Thermal Expansion (CTE) mismatch between the silicon die and polyimide tape can cause plastic strains in the inner leads. Several design variations are quantified. Those with first order effects were found to be encapsulant material, lead length, and lead material
Keywords :
Weibull distribution; encapsulation; failure (mechanical); fatigue; finite element analysis; lead bonding; tape automated bonding; thermal expansion; 3D nonlinear finite element analysis; CTE mismatch; TAB inner lead fatigue; encapsulant material; failure mechanism; fatigue failures; lead length; lead material; plastic strains; thermal cycle environments; unexcised tape carrier; Assembly; Bonding; Failure analysis; Fatigue; Finite element methods; Polyimides; Qualifications; Silicon; Testing; Thermal expansion;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367550