Title :
Three dimensional finite element determination of current density and temperature distributions in pillar vias
Author :
Trattles, J.T. ; O´Neill, A.G. ; Mecrow, B.C.
Author_Institution :
Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ., UK
Abstract :
Current crowding and local heating in multilevel interconnects have been studied by the self-consistent solution of the electrical and thermal conduction equations in three dimensions using the finite element method. The results demonstrate the need for three dimensional simulations to optimise process design rules and to fully understand design trade-offs
Keywords :
current density; electromigration; finite element analysis; metallisation; temperature distribution; 3D finite element determination; current density; design trade-offs; electromigration induced failure; local heating; multilevel interconnects; pillar vias; process design rules; self-consistent solution; temperature distributions; thermal conduction equations; Current density; Electromigration; Equations; Finite element methods; Insulation life; Process design; Proximity effect; Resistance heating; Temperature distribution; Thermal conductivity;
Conference_Titel :
VLSI Multilevel Interconnection Conference, 1991, Proceedings., Eighth International IEEE
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-87942-673-X
DOI :
10.1109/VMIC.1991.153020
