Title :
Fine line circuit manufacturing technology with electroless copper plating
Author :
Akahoshi, Haruo ; Kawamoto, Mineo ; Itabashi, Takeyuki ; Miura, Osamu ; Takahashi, Akio ; Kobayashi, Shiro ; Miyazaki, Masashi ; Mutho, Tsunefumi ; Wajima, Motoyo ; Ishimaru, Toshiaki
Author_Institution :
Res. Lab., Hitachi Ltd., Ibaraki, Japan
Abstract :
Two types of additive processes for fine circuit pattern manufacturing technology using electroless copper plating have been developed. The processes offer high dimensional accuracy. Technical aspects of the additive processes, materials for the fabrication of additive circuits, and the performance of these circuits are reported here
Keywords :
copper; delamination; electroless deposition; fine-pitch technology; metallisation; multichip modules; printed circuit manufacture; Cu; MCM; PCB; PWB; additive processes; electroless Cu plating; fabrication; fine circuit pattern manufacturing technology; high dimensional accuracy; packaging; Additives; Chemical technology; Circuits; Copper; Etching; Fabrication; Laminates; Manufacturing processes; Resists; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367562
