DocumentCode :
2377118
Title :
Across the great divide: examination of simulation data with actual silicon waveforms improves device characterization and production test development
Author :
Austin, Tom ; Canlas, Charisma ; Morgan, Brady ; Rodriguez, Jorge Luis
Author_Institution :
Teradyne Inc., USA
fYear :
2002
fDate :
2002
Firstpage :
270
Lastpage :
279
Abstract :
Engineers face major challenges when they try to debug problems with a device being characterized or tested at a remote site. They find it difficult, time consuming, and error prone to gather waveform data from a separate facility for analysis. This paper discusses a tool for specifying data to be collected, automating its capture, and the means of displaying and comparing to waveforms previously collected through simulation of the device during the product design phase. Specific ways of viewing not only these different waveforms but also the relationships between them are presented. We also describe the development of such a system, its inclusion in the design flow for new IC development, and the resulting improvements in new product introduction from the viewpoint of design and test.
Keywords :
circuit simulation; data acquisition; electronic data interchange; integrated circuit design; integrated circuit modelling; integrated circuit testing; product development; production testing; IC development design flow; Si; actual silicon waveforms; data capture automation; data collection specification tool; device characterization; device debug; device production test development; product design; product design phase simulation; product introduction; product test; remote test site; simulation data; waveform comparison; waveform data; Analytical models; Data engineering; Design engineering; Displays; Integrated circuit modeling; Integrated circuit testing; Predictive models; Production; Silicon; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 2002. Proceedings. International
ISSN :
1089-3539
Print_ISBN :
0-7803-7542-4
Type :
conf
DOI :
10.1109/TEST.2002.1041769
Filename :
1041769
Link To Document :
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