• DocumentCode
    2378026
  • Title

    Polycrystalline CVD diamond in electronics: important cost factors

  • Author

    Singer, Adam

  • Author_Institution
    IBIS Assoc. Inc., Wellesley, MA, USA
  • fYear
    1994
  • fDate
    1-4 May 1994
  • Firstpage
    279
  • Lastpage
    285
  • Abstract
    In the development of a given technology, the process costs must be understood if commercial scale production is to be successful. To achieve this goal, Technical Cost Modeling has evolved from traditional costing methodologies in order to estimate the dynamics of a system of manufacture, and to be used as a tool for determining optimal scale-up conditions. For the manufacture of thermal management chemical vapor deposition (CVD) diamond, cost models have been developed in older to estimate the appropriate scale-up conditions for different CVD diamond deposition and finishing technologies in order to fabricate diamond substrates for electronics packaging. Subsequent cost analysis is then undertaken to assess the viability of diamond as an electronics packaging material. With this ability to identify the cost of future manufacturing scenarios, the R&D pace of a promising technology can be quickened, or the investment schedule in an unfavorable technology can be phased out
  • Keywords
    CVD coatings; costing; diamond; economics; electron device manufacture; packaging; C; R&D; Technical Cost Modeling; commercial scale production; cost models; costing methodologies; deposition technologies; diamond substrates; electronics packaging; finishing technologies; manufacturing system dynamics; polycrystalline CVD diamond; process costs; scale-up; thermal management chemical vapor deposition diamond; Chemical vapor deposition; Cost function; Costing; Electronic packaging thermal management; Electronics packaging; Production; Technology management; Thermal management; Thermal management of electronics; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1994. Proceedings., 44th
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-0914-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1994.367619
  • Filename
    367619