Title :
Thermal conductivity of molding compounds for plastic packaging
Author :
Bujard, P. ; Kühnlein, G. ; Ino, S. ; Shiobara, T.
Author_Institution :
Mater. Res., Ciba-Geigy SA, Basel, Switzerland
Abstract :
Alumina loaded new molding compounds feature a thermal conductivity up to 4.5 W/mK, a water uptake smaller than 0.2 weight %, a coefficient of thermal expansion of 10 ppm/K and an excellent popcorn resistance (0 cracks from 6). The thermal conductivity of such particulate-loaded polymers has been investigated as a function of the volume content (0 to 80%) of aluminum oxide, quartz and fused quartz. The thermal expansion and the specific heat have also been recorded. A new model allows one to calculate the thermal conductivity and the thermal expansion within a couple percent
Keywords :
filled polymers; plastic packaging; specific heat; thermal analysis; thermal conductivity; thermal expansion; Al2O3; CTE; SiO2; alumina loaded molding compounds; coefficient of thermal expansion; fused quartz; model; molding compounds; particulate-loaded polymers; plastic packaging; popcorn resistance; specific heat; thermal conductivity; thermal expansion; Ceramics; Conducting materials; Electronic packaging thermal management; Epoxy resins; Plastic packaging; Polymers; Thermal conductivity; Thermal expansion; Thermal loading; Thermal resistance;
Conference_Titel :
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-0914-6
DOI :
10.1109/ECTC.1994.367636