DocumentCode :
2378411
Title :
A MEMS device for measurement of skin friction with capacitive sensing
Author :
Zhe, Jiang ; Farmer, K.R. ; Modi, Vijay
Author_Institution :
Dept. of Mech. Eng., Columbia Univ., New York, NY, USA
fYear :
2001
fDate :
2001
Firstpage :
4
Lastpage :
7
Abstract :
A microfabricated floating-element sensor for the measurement of wall shear stress is developed. The design objective is to measure shear stress in the range of 0.1 to 2 Pa, with a spatial resolution of O(100 μm). The sensor is micromachined in an ultra-thin silicon wafer using wafer bonding and DRIE techniques. Preliminary test results have been obtained by applying an electrostatic force to the sensor instead of a fluid force. The floating element deflection is then measured using direct and differential capacitance techniques as well as an optical method for additional confirmation of the results. These test results have been compared to theoretical simulations using MEMCAD software. The results show that with this sensor design it is possible to measure a shear force as small as 5 nN ± 0.5 nN, corresponding to a shear stress level of 0.05 Pa ± 0.005 Pa
Keywords :
biomedical measurement; biosensors; capacitive sensors; friction; micromachining; microsensors; skin; sputter etching; wafer bonding; DRIE; MEMCAD software; MEMS device; Si; capacitive sensing; electrostatic force; floating-element sensor; microfabrication; micromachining; silicon wafer; skin friction measurement; wafer bonding; wall shear stress measurement; Electrostatic measurements; Force measurement; Force sensors; Friction; Microelectromechanical devices; Silicon; Skin; Spatial resolution; Stress measurement; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectromechanical Systems Conference, 2001
Conference_Location :
Berkeley, CA
Print_ISBN :
0-7803-7224-7
Type :
conf
DOI :
10.1109/MEMSC.2001.992728
Filename :
992728
Link To Document :
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