Title :
Fabrication and packaging of a miniature sensor array for harsh environments
Author :
Dijkstra, E.A. ; Olthuis, W. ; Bomer, J.G. ; Bergveld, P. ; Kronemeijer, D.A.
Author_Institution :
MESA Res. Inst., Twente Univ., Enschede, Netherlands
Abstract :
This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180°C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and packaging is described. Two devices were made and tested at the temperature and pressure mentioned above
Keywords :
microsensors; packaging; 180 C; 200 bar; chemically aggressive environment; fabrication; harsh environment; high pressure; high temperature; miniature sensor array; packaging; Chemical sensors; Conductivity; Fabrication; Mechanical sensors; Packaging; Petroleum; Pipelines; Powders; Sensor arrays; Temperature sensors;
Conference_Titel :
Microelectromechanical Systems Conference, 2001
Conference_Location :
Berkeley, CA
Print_ISBN :
0-7803-7224-7
DOI :
10.1109/MEMSC.2001.992731
